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News Release

29 January 1996

Commercial Development of High-Integration ASIC HG73G and HG73E
Using Second-Generation 0.35 Micron CMOS Process

- High-level integration of up to 1.5 million gates, high-speed of 250 MHz, and low power consumption -

Hitachi, Ltd. has recently developed the HG73 Series, employing a second-generation 0.35 micron CMOS process and offering high-level integration of up to 1.5 million gates, an ultra-high speed of 250 MHz, and low power consumption.

For the first product release phase of this series, Hitachi has completed commercial development of the HG73G gate array and the HG 73E embedded-function gate array, and will begin accepting orders in April 1996 in Japan.

This product is a new Hitachi ASIC series, and is based on Hitachi's "FFF" (flexible, fast, and friendly) concept for easy implementation of system on chip products. This series will provide users with a large cell library and easy-to-use design environment, thus shortening development time.


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