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April 10, 2000 |
Hitachi Releases Industry's First 128-Mbyte Micro DIMMs
-Large Capacity in a Small Package, for Sub-Notebook PC Expansion Memory |
Hitachi, Ltd. (TSE: 6501) today announced the HB52RD168GB Series of 144-pin Micro DIMMs*1, offering an industry-first 128-Mbyte capacity, for use as expansion memory in sub-notebook PCs. Sample shipments will begin in April 2000 in Japan. This new series employs the world's smallest class of 64-Mbit synchronous DRAMs (SDRAMs) and TCP*2 stacked-mounting technology with two TCPs to achieve the first Micro DIMMs with a 128-Mbyte capacity. Also being released are PC100 compatible 64-Mbyte HB52D88GB Series and 32-Mbyte HB52D48GB Series, with the same date of April 2000 for initial sample shipments in Japan. With the recent explosive growth in memory capacity requirements for PC operating systems and application software, large main and expansion memory capacities have also become essential for sub-notebook PCs. At the same time, the demanding space-saving requirements of sub-notebook PCs have led to the release of miniaturized 144-pin Micro DIMMs (external dimensions: 38.0 mm ¡ß 30.0 mm, ¡ß 3.8 mm) which is about 2/3 surface area of SO DIMMs*3 (external dimensions: 67.6 mm ¡ß 25.4 mm, ¡ß 3.8 mm). Following on from the previously released PC66-compatible 64-Mbyte and 32-Mbyte Micro DIMMs, Hitachi has now developed the HB52RD168GB Series of 128-Mbyte Micro DIMMs to meet the demand for greater capacity. In the new series, the use of 64-Mbit SDRAMs with a chip size of 38 mm2-the world's smallest class?and proprietary TCP stacked-mounting technology with two TCPs has made it possible to mount a total of 16 chips on the two board surfaces, and so achieve the industry's first 128-Mbyte MicroDIMM. The concurrently released 64-Mbyte HB52D88GB Series incorporates four DDPs*4 with two 64-Mbit SDRAM chips stacked as 128-Mbit SDRAM, while the 32-Mbyte HB52D48GB Series uses four 64-Mbit SDRAMs. These three series all feature a ¡ß64-bit configuration, 3.3 V power supply voltage, and PC100 (CAS Latency : 2, 3 ) compatibility, and low-current specification products are also available, for a total of 12 models with various combinations of features. The pin arrangement is identical to that of 144-pin SO DIMMs, but the pin pitch has been decreased to 0.5 mm. Future plans include the development of even larger-capacity 256-Mbyte models, and also dual-bank models offering lower power consumption. Notes: 1. DIMM: Dual Inline Memory Module 2. TCP: Tape Carrier Package 3. SO DIMM: Small Outline Dual Inline Memory Module 4. DDP: DDP is short for the Double Density Package (with two chips mounted ¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡¡ in a single TSOP package) < Typical Applications > ¡¦ Expansion memory or main memory for sub-notebook PCs < Prices in Japan > (For Reference) Part Number Memory Capacity Sample Price (Yen) HB52RD168GB Series 128 Mbytes 39,000 HB52D88GB Series 64 Mbytes 15,600 HB52D48GB Series 32 Mbytes 8,400
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WRITTEN BY Secretary's Office (C) Hitachi, Ltd. 2000. All rights reserved. |