Hitachi, Ltd. (TSE: 6501) today announced eight models in the HJ94/93D/93 Series
of Multi Chip Modules (MCMs) incorporating a high-performance Hitachi SuperH™*1
microprocessor and synchronous DRAM (SDRAM) in a single package. Sample shipments
will begin in March 2001 in Japan.
An MCM incorporates a variety of LSIs and ICs in a single package or on a single
board, enabling speedy development of smaller and more powerful systems. MCMs are
thus in great demand for a wide range of applications, including portable devices
and industrial and consumer products, and particularly in the field of digital still
cameras and digital video cameras with their demanding miniaturization requirements.
Hitachi is now releasing eight MCM models in three series, including the HJ945010BP
that features an SH-4 and four 64-Mbit SDRAMs, a mounting area approximately 1/6 that
of previous implementations, and a data transfer speed of 100 MHz between the SH-4
and SDRAM, as well as other models incorporating an SH3-DSP or SH-3. The new lineup
is as follows:
· HJ94 Series: SH-4 (SH7750) + SDRAM
HJ945010BP (with 32 MB SDRAM), HJ945020BP (with 16 MB SDRAM)
· HJ93D Series: SH3-DSP (SH7729) + SDRAM
HJ93D5030BP (with 32 MB SDRAM), HJ93D5040BP (with 16 MB SDRAM),
HJ93D2010BP (with 16 MB SDRAM)
· HJ93 Series: SH-3 (SH7709A) + SDRAM
HJ935050BP (with 32 MB SDRAM), HJ935060BP (with 16 MB SDRAM),
HJ932020BP (with 16 MB SDRAM)
[Background]
As electronic devices such as multimedia products continue to shrink in size while
offering improved speed and performance, higher performance is also demanded of the
microprocessors, memory, and other LSIs used in such products, while at the same
time system design is becoming increasingly sophisticated and complex as it
incorporates high-speed bus design and low-noise features. This has led to an
increasing demand for the SOC (System On Chip) approach offering a complete system
on a single chip, and MCMs which provide a system in a single package. With their
ability to cut development time, MCMs are particularly in demand as a means of
achieving diversification of a product concept and adapting rapidly to fast-changing
market needs.
[About the HJ94/93D/93 Series]
The new HJ94/93D/93 Series of MCMs include the following features.
(1) Enabling development of ultra-small systems with a high-speed bus
A single package houses a high-performance SuperH, with a proven track record as an
embedded microprocessor, together with high-speed SDRAM.
The HJ945010BP, incorporating an SH-4 and four 64-Mbit SDRAMs, features a BGA package
size of 31 mm x 31 mm, enabling the mounting area to be cut to approximately 1/6 that
of previous implementations using five packages (Hitachi comparison).
In addition, the high-speed bus offers a data transfer speed of 100 MHz between the
microprocessor and memory, eliminating the need for high-speed bus design by the user,
and thereby simplifying system design and enabling shorter development times to be
achieved.
(2) Lower EMI noise*2
Shorter board wiring reduces the effects of noise and allows stable, high-speed
operation to be achieved.
(3) Lower system costs
Using these new products, the user can reduce PCB size and the number of PCB layers,
with a corresponding reduction in PCB cost. Reducing the number of system components
also means lower assembly costs.
(4) Shorter MCM product development times
Custom products are also supported in addition to these new models. The time from
finalization of the MCM development product specifications to receipt of samples is
as little as eight weeks or so, enabling development time to be cut to approximately
1/6 that currently required for Hitachi ASIC design (assuming the use of existing LSI
chips).
The HJ94 Series, incorporating an SH7750 with an SH-4 CPU core that provides 200 MHz
performance, is suitable for applications such as high-speed image processing systems.
The HJ93D Series has a 133 MHz SH7729 with an SH3-DSP CPU core. The high-speed voice
and image data compression/expansion processing capabilities of its DSP make it
suitable for use in multimedia devices with a built-in browser or network products
such as routers with a built-in VoIP.
The HJ93 Series, incorporating a 133 MHz SH7709A with an SH-3 CPU core, offers low
power consumption that makes it the ideal choice for in portable information terminals
such as handheld PCs.
A BGA package is used for all eight models.
All SuperH microprocessor signals are output from the package, and allowing additional
memory to be connected externally as required by the user system configuration.
For example, by using a Hitachi's x32/ x64-bit byte-wide 128/256-Mbit SDRAM
(HM5212325FBPC, HM5212325FBP, HM5225325FBP, or HM5225645FBP), incorporating two
or four 64-Mbit SDRAMs in a package (BGA), as expansion memory, the system memory
capacity can readily be increased while achieving a compact system size.
The E10A card emulator is available as a support tool when designing a system that
uses one of these new products.
Future development plans in order to support high-performance and smaller user systems,
Hitachi will continue to expand HItaMCM product lineup through the development of
incorporating byte-wide DRAMs (64-Mbit SDRAM x32/x64-bit products) which is now
underdeveloping and built-in new SuperH microprocessor synchronize with the
SuperH device line up.
Notes: 1. SuperH is a trademark of Hitachi, Ltd.
2. EMI: Electromagnetic interference
< Applicable system products >
High-speed image processing applications, including digital still cameras and digital
video cameras, portable products, FA, industrial applications, robotics, consumer
products, OA peripherals, etc.
< Prices in Japan > (For reference)
Microprocessor | Package (BGA) | Memory Capacity | Model | Sample Price (Yen) |
SH7750 (SH-4 core) | 31 mm x 31 mm 353 pins | 32 MB | HJ945010BP | 11,600 |
16 MB | HJ945020BP | 8,500 |
SH7729 (SH3-DSP core) | 31 mm x 31 mm 353 pins | 32 MB | HJ93D5030BP | 10,500 |
16 MB | HJ93D5040BP | 7,400 |
13 mm x 19 mm 273 pins | 16 MB | HJ93D2010BP | 7,200 |
SH7709A (SH-3 core) | 31 mm x 31 mm 353 pins | 32 MB | HJ935050BP | 10,200 |
16 MB | HJ935060BP | 7,000 |
13 mm x 19 mm 273 pins | 16 MB | HJ932020BP | 6,900 |
Series | HJ94Series | HJ93D Series |
Product Code | HJ945010BP/945020BP | HJ93D5030BP /93D5040BP | HJ93D2010BP |
MPU | SH-4 (SH7750) | SH3-DSP (SH7729) | SH3-DSP (SH7729) |
Memory | 32 MB (HJ945010 BP) 16 MB (HJ945020BP) | 32MB (HJ93D5030BP) 16MB (HJ93D5040BP) | ----- 16 MB (HJ93D2010BP) |
MPU Operating frequency Internal bus
|
200 MHz max. (50 MHz min.) |
133 MHz max. (16 MHz min.) |
133 MHz max. (16 MHz min.) |
External bus
| 100 MHz max. (25 MHz min.) | 66 MHz max. (16 MHz min.) | 66 MHz max. (16 MHz min.) |
Operating power supply voltage VDDQ VDD |
3.0 V to 3.6 V 1.8 V to 2.07 V |
3.0 V to 3.6 V 1.75 V to 2.05 V |
3.0 V to 3.6 V 1.75 V to 2.05 V |
Operating temperature | 0°C to 70°C | 0°C to 70°C | 0°C to 70°C |
Package dimensions | 353-pin BGA Ball pitch: 1.27 mm 31 mm x 31 mm Thickness: 2.47 mm typ. | 353-pin BGA Ball pitch: 1.27 mm 31 mm x 31 mm Thickness: 2.47 mm typ. | 273-pin BGA Ball pitch: 0.8 mm 13 mm x 19 mm Thickness: 1.70 mm typ. |
Features
| Memory capacity can be changed with same package. Between SH-4 and SDRAMs can be accessed up to 100MHz. | Memory capacity can be changed with same package. Between SH3-DSP and SDRAMs can be accessed up to 66MHz. | Ultra-small size. Between SH3-DSP and SDRAMs can be accessed up to 66MHz. |
Series | HJ93 Series |
Product Code | HJ935050BP /935060BP | HJ932020BP |
MPU | SH-3 (SH7709A) | SH-3 (SH7709A) |
Memory | 32 MB(HJ935050BP) 16 MB (HJ935060BP) | ----- 16 MB (HJ932020BP) |
MPU Operating frequency Internal bus External bus |
133 MHz max. (16 MHz min.) 66 MHz max. (16 MHz min.) |
133 MHz max. (16 MHz min.) 66 MHz max. (16 MHz min.) |
Operating power supply voltage VDDQ VDD |
3.0 V to 3.6 V 1.75 V to 2.05 V |
3.0 V to 3.6 V 1.75 V to 2.05 V |
Operating temperature | 0°C to 70°C | 0°C to 70°C |
Package dimensions
| 353-pin BGA Ball pitch: 1.27 mm 31 mm x 31 mm Thickness: 2.47 mm typ. | 273-pin BGA Ball pitch: 0.8 mm 13 mm x 19 mm Thickness: 1.70 mm typ. |
Features
| Memory capacity can be changed with same package. Between SH-3 and SDRAMs can be accessed up to 66MHz. | Ultra-small size. Between SH-3 and SDRAMs can be accessed up to 66MHz. |
|