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February 1, 2001
Hitachi Releases Eight Models in HJ94/93D/93 Series of Multi Chip Modules Incorporating a SuperH Microprocessor and Synchronous DRAM in a Single Package
- For small, high-speed, high-performance systems -
#
Hitachi, Ltd. (TSE: 6501) today announced eight models in the HJ94/93D/93 Series 
of Multi Chip Modules (MCMs) incorporating a high-performance Hitachi SuperH™*1 
microprocessor and synchronous DRAM (SDRAM) in a single package.  Sample shipments 
will begin in March 2001 in Japan.

An MCM incorporates a variety of LSIs and ICs in a single package or on a single 
board, enabling speedy development of smaller and more powerful systems.  MCMs are 
thus in great demand for a wide range of applications, including portable devices 
and industrial and consumer products, and particularly in the field of digital still 
cameras and digital video cameras with their demanding miniaturization requirements.  
Hitachi is now releasing eight MCM models in three series, including the HJ945010BP 
that features an SH-4 and four 64-Mbit SDRAMs, a mounting area approximately 1/6 that 
of previous implementations, and a data transfer speed of 100 MHz between the SH-4 
and SDRAM, as well as other models incorporating an SH3-DSP or SH-3.  The new lineup 
is as follows:

· HJ94 Series: SH-4 (SH7750) + SDRAM
  HJ945010BP (with 32 MB SDRAM), HJ945020BP (with 16 MB SDRAM)
· HJ93D Series: SH3-DSP (SH7729) + SDRAM
  HJ93D5030BP (with 32 MB SDRAM), HJ93D5040BP (with 16 MB SDRAM), 
  HJ93D2010BP (with 16 MB SDRAM)
· HJ93 Series: SH-3 (SH7709A) + SDRAM
  HJ935050BP (with 32 MB SDRAM), HJ935060BP (with 16 MB SDRAM), 
  HJ932020BP (with 16 MB SDRAM)

[Background]
As electronic devices such as multimedia products continue to shrink in size while 
offering improved speed and performance, higher performance is also demanded of the 
microprocessors, memory, and other LSIs used in such products, while at the same 
time system design is becoming increasingly sophisticated and complex as it 
incorporates high-speed bus design and low-noise features.  This has led to an 
increasing demand for the SOC (System On Chip) approach offering a complete system 
on a single chip, and MCMs which provide a system in a single package.  With their 
ability to cut development time, MCMs are particularly in demand as a means of 
achieving diversification of a product concept and adapting rapidly to fast-changing 
market needs.

[About the HJ94/93D/93 Series]
The new HJ94/93D/93 Series of MCMs include the following features.

(1) Enabling development of ultra-small systems with a high-speed bus

A single package houses a high-performance SuperH, with a proven track record as an 
embedded microprocessor, together with high-speed SDRAM.

The HJ945010BP, incorporating an SH-4 and four 64-Mbit SDRAMs, features a BGA package
size of 31 mm x 31 mm, enabling the mounting area to be cut to approximately 1/6 that 
of previous implementations using five packages (Hitachi comparison).

In addition, the high-speed bus offers a data transfer speed of 100 MHz between the 
microprocessor and memory, eliminating the need for high-speed bus design by the user, 
and thereby simplifying system design and enabling shorter development times to be 
achieved.

(2) Lower EMI noise*2 

Shorter board wiring reduces the effects of noise and allows stable, high-speed 
operation to be achieved.

(3) Lower system costs

Using these new products, the user can reduce PCB size and the number of PCB layers, 
with a corresponding reduction in PCB cost.  Reducing the number of system components 
also means lower assembly costs.

(4) Shorter MCM product development times

Custom products are also supported in addition to these new models.  The time from 
finalization of the MCM development product specifications to receipt of samples is 
as little as eight weeks or so, enabling development time to be cut to approximately 
1/6 that currently required for Hitachi ASIC design (assuming the use of existing LSI 
chips).

The HJ94 Series, incorporating an SH7750 with an SH-4 CPU core that provides 200 MHz 
performance, is suitable for applications such as high-speed image processing systems.

The HJ93D Series has a 133 MHz SH7729 with an SH3-DSP CPU core.  The high-speed voice 
and image data compression/expansion processing capabilities of its DSP make it 
suitable for use in multimedia devices with a built-in browser or network products 
such as routers with a built-in VoIP.

The HJ93 Series, incorporating a 133 MHz SH7709A with an SH-3 CPU core, offers low 
power consumption that makes it the ideal choice for in portable information terminals 
such as handheld PCs.

A BGA package is used for all eight models. 

All SuperH microprocessor signals are output from the package, and allowing additional 
memory to be connected externally as required by the user system configuration.

For example, by using a Hitachi's x32/ x64-bit byte-wide 128/256-Mbit SDRAM 
(HM5212325FBPC, HM5212325FBP, HM5225325FBP, or HM5225645FBP), incorporating two 
or four 64-Mbit SDRAMs in a package (BGA), as expansion memory, the system memory 
capacity can readily be increased while achieving a compact system size.

The E10A card emulator is available as a support tool when designing a system that 
uses one of these new products.

Future development plans in order to support high-performance and smaller user systems, 
Hitachi will continue to expand HItaMCM product lineup through the development of 
incorporating byte-wide DRAMs (64-Mbit SDRAM x32/x64-bit products) which is now 
underdeveloping and built-in new SuperH microprocessor synchronize with the 
SuperH device line up.

Notes:  1.   SuperH is a trademark of Hitachi, Ltd.
        2.   EMI: Electromagnetic interference

< Applicable system products >
High-speed image processing applications, including digital still cameras and digital 
video cameras, portable products, FA, industrial applications, robotics, consumer 
products, OA peripherals, etc.
< Prices in Japan > (For reference)
MicroprocessorPackage (BGA)Memory
Capacity
ModelSample Price (Yen)
SH7750
(SH-4 core)
31 mm x 31 mm
353 pins
32 MBHJ945010BP11,600
16 MBHJ945020BP8,500
SH7729
(SH3-DSP core)
31 mm x 31 mm
353 pins
32 MBHJ93D5030BP10,500
16 MBHJ93D5040BP7,400
13 mm x 19 mm
273 pins
16 MBHJ93D2010BP7,200
SH7709A
(SH-3 core)
31 mm x 31 mm
353 pins
32 MBHJ935050BP10,200
16 MBHJ935060BP7,000
13 mm x 19 mm
273 pins
16 MBHJ932020BP6,900

SeriesHJ94SeriesHJ93D Series
Product CodeHJ945010BP/945020BPHJ93D5030BP
/93D5040BP
HJ93D2010BP
MPUSH-4 (SH7750)SH3-DSP (SH7729)SH3-DSP (SH7729)
Memory32 MB
(HJ945010 BP)
16 MB
(HJ945020BP)
32MB (HJ93D5030BP)
16MB (HJ93D5040BP)
-----
16 MB (HJ93D2010BP)
MPU Operating
frequency
Internal bus


200 MHz max.
(50 MHz min.)


133 MHz max.
(16 MHz min.)


133 MHz max.
(16 MHz min.)
External bus
100 MHz max.
(25 MHz min.)
66 MHz max.
(16 MHz min.)
66 MHz max.
(16 MHz min.)
Operating power
supply voltage
VDDQ
VDD




3.0 V to 3.6 V
1.8 V to 2.07 V




3.0 V to 3.6 V
1.75 V to 2.05 V




3.0 V to 3.6 V
1.75 V to 2.05 V
Operating
temperature
0°C to 70°C0°C to 70°C0°C to 70°C
Package
dimensions
353-pin BGA
Ball pitch: 1.27 mm
31 mm x 31 mm
Thickness: 2.47 mm typ.
353-pin BGA
Ball pitch: 1.27 mm
31 mm x 31 mm
Thickness: 2.47 mm typ.
273-pin BGA
Ball pitch: 0.8 mm
13 mm x 19 mm
Thickness: 1.70 mm typ.
Features



Memory capacity can be changed with same package.
Between SH-4 and SDRAMs can be accessed
up to 100MHz.
Memory capacity can be changed with same package.
Between SH3-DSP and SDRAMs can be accessed
up to 66MHz.
Ultra-small size.
Between SH3-DSP and
SDRAMs can be accessed
up to 66MHz.

SeriesHJ93 Series
Product CodeHJ935050BP
/935060BP
HJ932020BP
MPUSH-3
(SH7709A)
SH-3
(SH7709A)
Memory32 MB(HJ935050BP)
16 MB (HJ935060BP)
-----
16 MB (HJ932020BP)
MPU Operating frequency
Internal bus
External bus


133 MHz max. (16 MHz min.)
66 MHz max. (16 MHz min.)


133 MHz max. (16 MHz min.)
66 MHz max. (16 MHz min.)
Operating power supply voltage
VDDQ
VDD


3.0 V to 3.6 V
1.75 V to 2.05 V


3.0 V to 3.6 V
1.75 V to 2.05 V
Operating temperature0°C to 70°C0°C to 70°C
Package dimensions


353-pin BGA
Ball pitch: 1.27 mm
31 mm x 31 mm
Thickness: 2.47 mm typ.
273-pin BGA
Ball pitch: 0.8 mm
13 mm x 19 mm
Thickness: 1.70 mm typ.
Features





Memory capacity can be
changed with same package.
Between SH-3 and SDRAMs can be accessed up to 66MHz.
Ultra-small size.
Between SH-3 and SDRAMs can be accessed up to 66MHz.

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