February 15, 2017
3D printing technology for semiconductors developed reducing MEMS sensor manufacturing time
Flowchart of MEMS sensor design & fabrication with this technology
Hitachi today announced the development of 3D printing technology for semiconductors that shortens the manufacturing period of MEMS sensors that measure vibration, acceleration, etc. Conventionally, MEMS sensors have been fabricated on a mass-production basis, and the design and manufacturing could take from roughly three months up to one year. In addition to the new 3D printing technology developed, artificial intelligence (AI) was applied to automate the design of sensor shape and dimensions, resulting in the design and fabrication of 100 vibration MEMS sensors within one month.
